Global 3D IC Market, Forecast 2022

The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and reducing power consumption to fulfill electronic device requirements.

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General

Geography Covered
Global
Publisher:
Market Research Future
Publication Date
May. 2017
Pages
78
Version:
2017
Language
  • English
Format
License

Market Scenario:
The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and reducing power consumption to fulfill electronic device requirements. These ICs are in great demand by military & aerospace, medical and consumer electronics industries to fulfill need of integrating disparate technologies which includes logic, memory, RF, sensor in small forms for industrial applications.
The global 3D IC’s market is a very dynamic market and is expected to witness stable growth over the forecast period. The growth of the 3D IC’s market is influenced by the increasing demand for advanced electronic products with a smaller form factor, and superior functionality has driven semiconductor industry to develop more innovative advanced packaging technologies and high demand for 3D packaging using TSVs driving 3D IC development. However, technical limitation and IC/package co-design are the factors hindering the growth of the 3D IC’s market.
The global 3D IC’s market is estimated to grow from USD 4,045.9 million in 2016 to USD 10,476.6 million by 2023, growing at a CAGR of 17.18% from 2017 to 2023.
Objective Study of 3D IC’s Market:
• To provide detailed analysis of the market structure along with forecast of the various segments and sub-segments of the global 3D IC’s market.
• To provide insights about factors affecting the market growth.
• To analyze the global 3D IC’s market based porter’s five force analysis etc.
• To provide historical and forecast revenue of the market segments and sub-segments with respect to four main geographies and their countries- North America, Europe, Asia, and Rest of the World (ROW).
• To provide country level analysis of the market with respect to the current market size and future prospective.
• To provide country level analysis of the market for segment by type, end-users and region.
• To provide strategic profiling of key players in the market, comprehensively analyzing their core competencies, and drawing a competitive landscape for the market.
• To track and analyze competitive developments such as joint ventures, strategic alliances, mergers and acquisitions, new product developments, and research and developments in the global 3D IC’s market.
Segments
For the purpose of this study, Market Research Future has segmented the market of 3D IC’s into technology, components, products, application and region.
Technology-
• 3D Stacked ICs
• 3D Monolithic ICs
Components-
• Through Silicon Vias (TSVs)
• Through Glass Vias (TGVs)
• Others
Product-
• CMOS Image Sensors
• 3D Memory
• MEMS & Sensors
• Light Emitting Diodes (LEDs)
Applications-
• IT/Telecommunications
• Consumer Electronics
• Industrial
• Aerospace & Defence
• Automotive
• Medical
Region
• North-America
• Europe
• Asia-Pacific
• RoW

Key Players
The key players in the global 3D IC market include Xilinx Inc., Tezzaron Semiconductor Corporation, and BeSang Inc., Monolithic 3D Inc., United Microelectronics Corporation, 3M Company, Intel Corporation, and IBM Corporation among others.
Regional Analysis-
North America is the leading economy in 3D IC’s market followed by Europe. However, Asia-Pacific is the fastest growing economy in the market majorly due to maturing production sector in India and China and largest production of semiconductor industry Also, Middle East & Africa has a slow growth majorly due to growing industrialization and presence of automobile industries in this region.
In 2016, North America is estimated to generate the largest revenue of USD 988.75 million followed by Europe with USD 1084.70 million generated in 2016. This trend is projected to change by 2022, where Asia-pacific would raise its revenue to USD 4200.02 million from USD 1568.12 million in year 2016. Asia-Pacific is predicted to show a high revenue growth at a CAGR of 17.85% from 2016 to 2023. Middle East & Africa is expected to grow with slow growth rate of 11.09% during forecast period 2016 to 2022.
Key Findings-
• Global 3D IC’s technology market has reached USD 4,045.87 million in 2016 and is projected to exhibit USD 10,476.60 million by the end of 2023 with a growing CAGR of 17.18%.
• By technology, 3D ICs market is dominated by 3D stacked ICs which has generated USD 3,442.07 million in 2016 and projected to reach USD 8,656.95 million by the end of 2022 with 16.62% CAGR. Whereas, monolithic 3D ICs is expected to be the fastest growing market with 20.18% CAGR during forecast period 2016-2022. The high demand for cost saving and high performance logical chips is driving the 3D ICs market in the near future.
• Global 3D ICs component market is dominated by through silicon vias (TSVs) which has generated USD 2,570.92 million in 2016 and projected to reach USD 7,332.03 million by the end of 2022. It also expected to be the fastest growing market with 19.08% CAGR during forecast period 2016-2022.
• By product segment of 3D IC’s market, CMOS image sensors has generated highest revenue of USD 1,430.63 million in 2016 and projected to reach USD 3,740.94 million by the end of forecast period 2022.
• Globally, 3D IC market by applications is dominated by IT/Telecommunication industry and has generated USD 994.27 million in 2016 and is projected to reach USD 1,996.48 million by the end of 2022. Followed by consumer electronics and industrial application which are growing with 23.65% CAGR and 13.42% CAGR respectively during forecast period 2016-2022.
• By region, in 2016, North America is estimated to generate the largest revenue of USD 988.75 million and expected to reach USD 3,126.80 million by 2022, 21.15% CAGR followed by Europe. Asia-Pacific is growing with a CAGR of 17.85% thereby would increase its revenue from USD 1,568.12 million to USD 4,200.02 million by 2023.

 

1 Executive Summary 10
2 Market Dynamics 11
2.1 Market Drivers 11
2.1.1 Increasing demand for advanced electronic products with a smaller form factor, and superior functionality has driven semiconductor industry to develop more innovative advanced packaging technologies 11
2.1.2 High demand for 3D packaging using TSVs driving 3D IC development 12
2.2 Market Challenges 12
2.2.1 Technical Limitation 12
2.2.2 IC/Package Co-design 13
2.3 3D ICs Supply Chain 13
2.4 Porter’s Five Forces Analysis 14
3 Global 3D ICs Market, By Technology 15
3.1 3D IC Technology Type Market 15
3.1.1 Market by Sub-segment 16
3.1.1.1 3D Stacked ICs 16
3.1.1.2 Monolithic 3D ICs 17
3.2 3D IC Packaging & Integration Type 19
3.2.1 3D System in Package (3D SiP) 19
3.2.2 3D Wafer Level Package (3D WLP) 20
3.2.3 2.5D & 3D Interposer 20
3.2.4 3D Heterogeneous Integration 21
4 Global 3D IC Market, By Component 22
4.1 Introduction 22
4.2 Market by Sub-Segment 23
4.2.1 Through Silicon Vias (TSVs) 23
4.2.2 Through Glass Vias (TGVs) 24
5 Global 3D IC Market, By Products 26
5.1 Introduction 26
5.2 Market by Sub-Segment 27
5.2.1 CMOS Image Sensors 27
5.2.2 3D Memory 28
5.2.3 MEMS & Sensors 30
5.2.4 Light Emitting Diodes (LEDs) 31

6 Global 3D ICs Market, By Applications 32
6.1 Introduction 32
6.2 Market by Sub-Segment 34
6.2.1 IT/Telecommunications 34
6.2.2 Consumer Electronics 35
6.2.3 Industrial 36
6.2.4 Aerospace & Defence 37
6.2.5 Automotive 38
6.2.6 Medical 39
7 Global 3D ICs Market, By Region 41
7.1 Introduction 41
7.2 Market by Regions 43
7.2.1 North America 43
7.2.2 Europe 49
7.2.3 Asia-Pacific 55
7.2.4 Middle East & Africa 61
8 Competitive Landscape 65
8.1 Introduction 65
8.2 Competitive Scenario 65
8.3 Market Share Analysis 66
8.4 Company Profiles 67
8.4.1 Xilinx Inc. 67
8.4.1.1 Company Overview 67
8.4.1.2 Product/Services Offering 68
8.4.1.3 Strategy 68
8.4.1.4 SWOT Analysis 69
8.4.2 Tezzaron Semiconductor Corporation 70
8.4.2.1 Company Overview 70
8.4.2.2 Product/Services Offering 70
8.4.3 Business Strategy 70
8.4.3.1 SWOT Analysis 71
8.4.4 BeSang Inc. 72
8.4.4.1 Company Overview 72
8.4.4.2 Product/Services Offering 72
8.4.4.3 Business Strategy 72
8.4.4.4 SWOT Analysis 72
8.4.5 Monolithic 3D Inc. 73
8.4.5.1 Company Overview 73
8.4.5.2 Product/Services Offering 73
8.4.5.3 Business Strategy 73
8.4.5.4 SWOT Analysis 74
8.4.6 United Microelectronics Corporation 75
8.4.6.1 Company Overview 75
8.4.6.2 Product/Services Offering 75
8.4.6.3 Business Strategy 76
8.4.6.4 SWOT Analysis 76
8.4.7 3M Company 77
8.4.7.1 Overview 77
8.4.8 Intel Corporation 78
8.4.8.1 Company Overview 78
8.4.8.2 Product/Services Offering 78
8.4.9 IBM Corporation 79
8.4.9.1 Company Overview 79
9 Appendix 80
9.1 Scope of the Study 80
9.1.1 Research Objective 80
9.1.2 Assumption 80
9.1.3 Limitation 81
9.2 Market Structure 81
10 Research Methodologies 82
10.1 Research Process 82
10.2 Primary Research 82
10.3 Secondary Research 83
10.4 Market Size Estimation 83
10.5 Forecast Model 84

TABLE 1 GLOBAL 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION) 15
TABLE 2 GLOBAL 3D STACKED ICS MARKET, 2016-2022 (USD MILLION) 17
TABLE 3 GLOBAL MONOLITHIC 3D ICS MARKET, 2016-2022 (USD MILLION) 18
TABLE 4 GLOBAL 3D IC MARKET, BY COMPONENT, 2016-2022 (USD MILLION) 22
TABLE 5 GLOBAL THROUGH SILICON VIAS (TSV) IN 3D IC MARKET, 2016-2022 (USD MILLION) 24
TABLE 6 GLOBAL THROUGH GLASS VIAS (TGV) IN 3D IC MARKET, 2016-2022 (USD MILLION) 25
TABLE 7 GLOBAL 3D IC MARKET, BY PRODUCT, 2016-2022 (USD MILLION) 26
TABLE 8 GLOBAL CMOS IMAGE SENSORS (CIS) IN 3D IC MARKET, 2016-2022 (USD MILLION) 28
TABLE 9 GLOBAL 3D MEMORY IN 3D IC MARKET, 2016-2022 (USD MILLION) 29
TABLE 10 GLOBAL MEMS & SENSORS IN 3D IC MARKET, 2016-2022 (USD MILLION) 30
TABLE 11 GLOBAL LIGHT EMITTING DIODES (LEDS) IN 3D IC MARKET, 2016-2022 (USD MILLION) 31
TABLE 12 GLOBAL 3D IC MARKET, BY APPLICATIONS, 2016-2022 (USD MILLION) 33
TABLE 13 GLOBAL IT/TELECOMMUNICATIONS MARKET IN 3D IC, 2016-2022 (USD MILLION) 34
TABLE 14 GLOBAL CONSUMER ELECTRONICS MARKET IN 3D IC, 2016-2022 (USD MILLION) 35
TABLE 15 GLOBAL INDUSTRIAL MARKET IN 3D IC, 2016-2022 (USD MILLION) 37
TABLE 16 GLOBAL AEROSPACE & DEFENSE MARKET IN 3D IC, 2016-2022 (USD MILLION) 38
TABLE 17 GLOBAL AUTOMOTIVE MARKET IN 3D IC, 2016-2022 (USD MILLION) 39
TABLE 18 GLOBAL MEDICAL MARKET IN 3D IC, 2016-2022 (USD MILLION) 40
TABLE 19 GLOBAL 3D ICS MARKET, BY REGION, 2016-2022 (USD MILLION) 42
TABLE 20 NORTH AMERICA 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION) 44
TABLE 21 NORTH AMERICA 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION) 45
TABLE 22 NORTH AMERICA 3D IC MARKET BY COMPONENT, 2016-2022 (USD MILLION) 46
TABLE 23 NORTH AMERICA 3D IC MARKET BY PRODUCT, 2016-2022 (USD MILLION) 47
TABLE 24 NORTH AMERICA 3D IC MARKET BY APPLICATION, 2016-2022 (USD MILLION) 48
TABLE 25 EUROPE 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION) 50
TABLE 26 EUROPE 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION) 51
TABLE 27 EUROPE 3D IC MARKET BY COMPONENT, 2016-2022 (USD MILLION) 52
TABLE 28 EUROPE 3D IC MARKET BY PRODUCT, 2016-2022 (USD MILLION) 53
TABLE 29 EUROPE 3D IC MARKET BY APPLICATION, 2016-2022 (USD MILLION) 54
TABLE 30 ASIA-PACIFIC 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION) 56
TABLE 31 ASIA-PACIFIC 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION) 57
TABLE 32 ASIA-PACIFIC 3D IC MARKET BY COMPONENT, 2016-2022 (USD MILLION) 58
TABLE 33 ASIA-PACIFIC 3D IC MARKET BY PRODUCT, 2016-2022 (USD MILLION) 59
TABLE 34 ASIA-PACIFIC 3D IC MARKET BY APPLICATION, 2016-2022 (USD MILLION) 60
TABLE 35 MIDDLE EAST & AFRICA 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION) 61
TABLE 36 MIDDLE EAST & AFRICA 3D IC MARKET BY COMPONENT, 2016-2022 (USD MILLION) 62
TABLE 37 MIDDLE EAST & AFRICA 3D IC MARKET BY PRODUCT, 2016-2022 (USD MILLION) 63
TABLE 38 MIDDLE EAST & AFRICA 3D IC MARKET BY APPLICATION, 2016-2022 (USD MILLION) 64

FIGURE 1 GLOBAL 3D ICS MARKET: DRIVERS & CHALLENGES 11
FIGURE 2 GLOBAL 3D IC SUPPLY CHAIN 13
FIGURE 3 GLOBAL 3D IC MARKET: PORTER’S FIVE FORCES ANALYSIS 14
FIGURE 4 GLOBAL 3D IC MARKET BY TECHNOLOGY TYPE, 2016-2022 (USD MILLION) 15
FIGURE 5 GLOBAL 3D STACKED ICS MARKET, 2016 & 2022 (USD MILLION) 16
FIGURE 6 GLOBAL MONOLITHIC 3D ICS MARKET, 2016 & 2022 (USD MILLION) 18
FIGURE 7 GLOBAL 3D IC MARKET, BY COMPONENT, 2016-2022 (USD MILLION) 22
FIGURE 8 GLOBAL THROUGH SILICON VIAS (TSV) IN 3D IC MARKET, 2016 & 2022 (USD MILLION) 23
FIGURE 9 GLOBAL THROUGH GLASS VIAS (TGV) IN 3D IC MARKET, 2016 & 2022 (USD MILLION) 25
FIGURE 10 GLOBAL 3D IC MARKET, BY PRODUCT, 2016-2022 (USD MILLION) 26
FIGURE 11 GLOBAL CMOS IMAGE SENSORS (CIS) IN 3D IC MARKET, 2016 & 2022 (USD MILLION) 27
FIGURE 12 GLOBAL 3D MEMORY IN 3D IC MARKET, 2016 & 2022 (USD MILLION) 29
FIGURE 13 GLOBAL MEMS & SENSORS IN 3D IC MARKET, 2016 & 2022 (USD MILLION) 30
FIGURE 14 GLOBAL LIGHT EMITTING DIODES (LEDS) IN 3D IC MARKET, 2016 & 2022 (USD MILLION) 31
FIGURE 15 GLOBAL 3D IC MARKET, BY APPLICATIONS, 2016-2022 (USD MILLION) 32
FIGURE 16 GLOBAL IT/TELECOMMUNICATIONS MARKET IN 3D IC, 2016 & 2022 (USD MILLION) 34
FIGURE 17 GLOBAL CONSUMER ELECTRONICS MARKET IN 3D IC, 2016 & 2022 (USD MILLION) 35
FIGURE 18 GLOBAL INDUSTRIAL MARKET IN 3D IC, 2016 & 2022 (USD MILLION) 36
FIGURE 19 GLOBAL AEROSPACE & DEFENSE MARKET IN 3D IC, 2016 & 2022 (USD MILLION) 37
FIGURE 20 GLOBAL AUTOMOTIVE MARKET IN 3D IC, 2016 & 2022 (USD MILLION) 38
FIGURE 21 GLOBAL MEDICAL MARKET IN 3D IC, 2016 & 2022 (USD MILLION) 39
FIGURE 22 GLOBAL 3D IC MARKET, BY REGION, 2016-2022 (USD MILLION) 42
FIGURE 23 NORTH AMERICA 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION) 44
FIGURE 24 NORTH AMERICA 3D IC MARKET BY TECHNOLOGY TYPE, 2016 & 2022 (%) 45
FIGURE 25 NORTH AMERICA 3D IC MARKET BY COMPONENT, 2016 & 2022 (%) 45
FIGURE 26 NORTH AMERICA 3D IC MARKET BY PRODUCT, 2016 & 2022 (%) 46
FIGURE 27 NORTH AMERICA 3D IC MARKET BY APPLICATION, 2016 & 2022 (%) 47
FIGURE 28 EUROPE 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION) 50
FIGURE 29 EUROPE 3D IC MARKET BY TECHNOLOGY TYPE, 2016 & 2022 (%) 51
FIGURE 30 EUROPE 3D IC MARKET BY COMPONENT, 2016 & 2022 (%) 51
FIGURE 31 EUROPE 3D IC MARKET BY PRODUCT, 2016 & 2022 (%) 52
FIGURE 32 EUROPE 3D IC MARKET BY APPLICATION, 2016 & 2022 (%) 53
FIGURE 33 ASIA-PACIFIC 3D IC MARKET BY COUNTRY, 2016-2022 (USD MILLION) 56
FIGURE 34 ASIA-PACIFIC 3D IC MARKET BY TECHNOLOGY TYPE, 2016 & 2022 (%) 57
FIGURE 35 ASIA-PACIFIC 3D IC MARKET BY COMPONENT, 2016 & 2022 (%) 57
FIGURE 36 ASIA-PACIFIC 3D IC MARKET BY PRODUCT, 2016 & 2022 (%) 58
FIGURE 37 ASIA-PACIFIC 3D IC MARKET BY APPLICATION, 2016 & 2022 (%) 59
FIGURE 38 MIDDLE EAST & AFRICA 3D IC MARKET BY TECHNOLOGY TYPE, 2016 & 2022 (%) 61
FIGURE 39 MIDDLE EAST & AFRICA 3D IC MARKET BY COMPONENT, 2016 & 2022 (%) 62
FIGURE 40 MIDDLE EAST & AFRICA 3D IC MARKET BY PRODUCT, 2016 & 2022 (%) 63
FIGURE 41 MIDDLE EAST & AFRICA 3D IC MARKET BY APPLICATION, 2016 & 2022 (%) 64
FIGURE 42 GLOBAL 3D ICS MARKET, COMPETITIVE SECENARIO, 2016 65
FIGURE 43 GLOBAL 3D IC KEY PLAYERS MARKET SHARE, 2016 (%) 66
FIGURE 44 GLOBAL 3D ICS MARKET STRUCTURE 81
FIGURE 45 MRFR RESEARH PROCESS 82

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